DuploTEC SBF® – Structural Bonding Films for Smart Cards & Security Applications

Our Value Proposition:

We help card manufacturers 

• to create secure and reliable connections between chips and antennas
• to reduce supplier dependency by offering a reliable second source
• to remain competitive by reduction of energy costs and increasing output

We do this by providing an easy-to-use transfer film which can optionally be electrically conductive in z-direction and that works on in-use equipment.

Customer Benefits: Low activation temperature Easy die-cutting High flexibility after curing Outstanding mechanical durabillity High and reliable conductivity in z-direction

Our Value Proposition:

We help card manufacturers 

• to reduce supplier dependency by offering a reliable second source
• to remain competitive by reduction of energy costs and increasing output
• to increase their sustainability by reducing their energy consumption

We do this by providing an easy-to-use chip bonding tape that works on in-use equipment.

Customer Benefits: No formaldehyde Low activation temperature Easy die-cutting High flexibility after curing Outstanding mechanical durabillity

Our Value Proposition:

We help passport manufacturers 

• to increase their efficiency during the cover page lamination process
• to create secure connections between passport cover, inlay and inner pages
• to realize new material combinations

We do this by offering a flexible, thermoset adhesive that supports high speed roll-to-roll processes

Customer Benefits: Easy to use Roll-to-Roll ready Suitable for new material combinations High flexibility after curing Outstanding durability